	US 7,566,900 B2
	Integrated metrology tools for monitoring and controlling large area substrate processing chambers
Hienminh Huu Le, San Jose, Calif. (US); and Akihiro Hosokawa, Cupertino, Calif. (US)
Assigned to Applied Materials, Inc., Santa Clara, Calif. (US)
Filed on Aug. 31, 2005, as Appl. No. 11/216,801.
Prior Publication US 2007/0046927 A1, Mar. 01, 2007
Int. Cl. H01L 29/10 (2006.01)

U.S. Cl. 257—48

2 Claims

1. A metrology chamber of a substrate processing module adapted to monitor and/or control at least one substrate processing chamber of the substrate processing module, comprising:

at least one first metrology tool disposed in the metrology chamber, wherein the at least one first metrology tool is a film thickness measurement tool; and

at least one second metrology tool. physically separate and distinct from the at least one first metrology tool, disposed in the same metrology chamber, wherein there are at least two film thickness measurement tools and one of the film thickness measurement tools is placed to measure film thickness near the center of a substrate that has been processed in one of the at least one substrate processing chamber and the other film thickness measurement tool is placed to measure film thickness away from the center of the substrate.