| US 7,566,749 B2 | ||
| Conductive thermosets by extrusion | ||
| Alan Fischer, Cambridge, Mass. (US); Timothy Jozokos, Pelham, N.H. (US); James Leacock, Boston, Mass. (US); and Andrew Rich, Hanover, Mass. (US) | ||
| Assigned to Hyperion Catalysis International, Inc., Cambridge, Mass. (US) | ||
| Filed on Aug. 31, 2005, as Appl. No. 11/218,209. | ||
| Claims priority of provisional application 60/605769, filed on Aug. 31, 2004. | ||
| Prior Publication US 2007/0238826 A1, Oct. 11, 2007 | ||
| Int. Cl. C08K 3/04 (2006.01) | ||
| U.S. Cl. 524—496 [524/495] | 11 Claims |
| 1. A conductive thermoset precursor consisting essentially of:
a thermoset precursor having a viscosity greater than 15 poise, said thermoset precursor selected from the group consisting
of epoxy precursor, phenolic precursor, polyimide precursor, urethane precursor, polyester precursor, vinyl ester precursor
or silicone precursor, and
carbon nanotubes having diameters less than 1 micron,
wherein said carbon nanotubes are present at a concentration of 1 to 15% by weight.
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