| US 7,566,666 B2 | ||
| Composition for removing an insulation material and related methods | ||
| Chun-Deuk Lee, Hwaseong-si (Korea, Republic of); Jung-Jea Myung, Iksan-si (Korea, Republic of); Myun-Kyu Park, Iksan-si (Korea, Republic of); Dong-Min Kang, Uiwang-si (Korea, Republic of); Byoung-Woo Son, Yongin-si (Korea, Republic of); Masayuki Takashima, Iksan-si (Korea, Republic of); Young-Nam Kim, Suwon-si (Korea, Republic of); and Hyun-Joon Kim, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do (Korea, Republic of); and Dongwoo Fine-Chem Co., Ltd., Iksan-si, Jeollabuk-do (Korea, Republic of) | ||
| Filed on Aug. 08, 2006, as Appl. No. 11/500,434. | ||
| Claims priority of application No. 10-2005-0072471 (KR), filed on Aug. 08, 2005. | ||
| Prior Publication US 2007/0082497 A1, Apr. 12, 2007 | ||
| Int. Cl. H01L 21/461 (2006.01) | ||
| U.S. Cl. 438—745 [438/756; 438/757; 257/E21.309] | 8 Claims |
| 1. A method of recycling a substrate comprising:
forming an insulation layer on the substrate, wherein the insulation layer comprises a low-k material and a protection material;
and,
removing the insulation layer from the substrate by applying to the substrate a composition comprising:
about 1 to 50 percent by weight of at least one peroxy acid compound selected from the group consisting of ammonium persulfate,
sodium persulfate, potassium persulfate, peroxynitric acid, peroxyphosphoric acid, peroxysulfuric acid, peroxyboric acid,
sodium peroxyborate, peroxyformic acid, peroxyacetic acid, peroxybenzoic acid, and peroxyphthalic acid;
about 0.1 to 35 percent by weight of a fluorine-containing compound;
and water,
wherein the protection material comprises at least one of silicon carbonitride (SiCN) and silicon nitride (SiN).
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