| US 7,566,588 B2 | ||
| Semiconductor device with a resin-sealed optical semiconductor element | ||
| Koujiro Kameyama, Gunma (Japan); and Kiyoshi Mita, Gunma (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan); and Kanto Sanyo Semiconductors Co., Ltd., Gunma (Japan) | ||
| Filed on Oct. 13, 2006, as Appl. No. 11/549,528. | ||
| Application 11/549528 is a division of application No. 10/787614, filed on Feb. 26, 2004, granted, now 7,183,589. | ||
| Claims priority of application No. 2003-052319 (JP), filed on Feb. 28, 2003; and application No. 2003-086383 (JP), filed on Mar. 26, 2003. | ||
| Prior Publication US 2007/0069232 A1, Mar. 29, 2007 | ||
| Int. Cl. H01L 33/00 (2006.01); H01L 31/0203 (2006.01) | ||
| U.S. Cl. 438—116 [438/25; 438/64; 257/E33.056; 257/E31.117] | 14 Claims |
| 1. A semiconductor device manufacturing method, comprising:
protecting a top surface of a cover layer with a sheet, wherein the cover layer is a part of the semiconductor device and
wherein the cover layer covers a top surface of an optical semiconductor element having a light receiving part or a light
emitting part; and
sealing, thereafter, the optical semiconductor element with a sealing resin,
wherein sealing the optical semiconductor element is performed using molding dies with one surface of the sheet contacting
the cover layer and the other surface of the sheet contacting inner walls of the molding dies.
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