US 7,566,390 B2
Wafer support apparatus for electroplating process and method for using the same
Carl Woods, Aptos, Calif. (US)
Assigned to Lam Research Corporation, Fremont, Calif. (US)
Filed on Dec. 15, 2004, as Appl. No. 11/14,527.
Prior Publication US 2006/0124451 A1, Jun. 15, 2006
Int. Cl. C25B 9/02 (2006.01)
U.S. Cl. 204—297.06  [204/198; 204/224 R; 204/228.1; 204/297.01; 204/297.09; 204/297.1; 204/297.14] 16 Claims
OG exemplary drawing
 
1. A multi-layered wafer handling system for use in an electroplating process, comprising:
a bottom film layer including a wafer placement area and a sacrificial anode surrounding the wafer placement area; and
a top film layer defined to be placed over the bottom film layer, the top film layer including an open region to be positioned over a surface of the wafer to be processed, the top film layer being defined to provide a liquid seal between the top film layer and the wafer to be processed about a periphery of the open region, the top film layer including first and second electrical circuits defined to electrically contact a peripheral top surface of the wafer to be processed at diametrically opposed locations.