| US 7,566,370 B2 | ||
| Wafer clamping apparatus and method for operating the same | ||
| John Parks, San Jose, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Feb. 22, 2008, as Appl. No. 12/36,111. | ||
| Application 12/036111 is a division of application No. 10/404402, filed on Mar. 31, 2003, granted, now 7,357,115. | ||
| Prior Publication US 2008/0142048 A1, Jun. 19, 2008 | ||
| Int. Cl. B08B 5/04 (2006.01) | ||
| U.S. Cl. 134—21 [134/1; 134/1.3; 134/902] | 18 Claims |
| 1. A method for clamping a wafer using pressure control, comprising:
disposing a wafer in a wafer receipt area on a wafer support plate;
applying a fluid above the wafer through a number of inlets in the wafer support plate, the number of inlets disposed in a
linear arrangement on a first side of the wafer receipt area of the wafer support plate, the fluid causing an increased pressure
above the wafer;
removing the fluid from above the wafer through a number of outlets in the wafer support plate, the number of outlets disposed
in a linear arrangement on a second side of the wafer receipt area of the wafer support plate that is opposite the first side,
wherein applying the fluid through the number of inlets and removing the fluid through the number of outlets causes the fluid
to flow across the wafer in a linear manner from the first side to the second side; and
decreasing a pressure below the wafer, the decreased pressure below the wafer being lower than a pressure above the wafer,
the decreased pressure below the wafer serving to hold the wafer toward the wafer support plate.
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