| US 7,565,994 B2 | ||
| Wire bonding apparatus | ||
| Yutaka Kondo, Tachikawa (Japan) | ||
| Assigned to Kabushiki Kaisha Shinkawa, Tokyo (Japan) | ||
| Filed on Feb. 17, 2005, as Appl. No. 11/61,271. | ||
| Claims priority of application No. 2004-045130 (JP), filed on Feb. 20, 2004. | ||
| Prior Publication US 2005/0184128 A1, Aug. 25, 2005 | ||
| Int. Cl. B23K 20/10 (2006.01); B23K 1/06 (2006.01) | ||
| U.S. Cl. 228—1.1 [228/4.5; 228/110.1; 228/180.5] | 3 Claims |
| 1. A wire bonding apparatus comprising:
a bonding arm having a capillary,
a piezoelectric element provided in the vicinity of said capillary so as to cause said capillary to vibrate in an axial direction
of said bonding arm, and
a preparatory pressure application means provided in said bonding arm so as to apply a preparatory pressure to said piezoelectric
element; wherein
said preparatory pressure application means is comprised of:
a front wedge-form attachment base and a rear wedge-form attachment base that are provided behind said piezoelectric element,
and
a preparatory pressure bolt that is screwed in said rear wedge-form attachment base from an outside of said bonding arm; and
wherein
a preparatory pressure is applied to said piezoelectric element by a movement of said front wedge-form attachment base in
said axial direction of said bonding arm that is caused by a movement of said rear wedge-form attachment base in a direction
of said preparatory pressure bolt as a result of a rotation of said preparatory pressure bolt.
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