| US 7,565,925 B2 | ||
| Heat dissipation device | ||
| Hsieh-Kun Lee, Fullerton, Calif. (US); Cheng-Tien Lai, Fullerton, Calif. (US); and Zhi-Bin Tan, Fullerton, Calif. (US) | ||
| Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Jun. 24, 2005, as Appl. No. 11/166,966. | ||
| Prior Publication US 2006/0289150 A1, Dec. 28, 2006 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 165—104.33 [257/715; 361/700] | 20 Claims |
| 1. A heat dissipation device comprising:
at least one heat pipe; and
a heat sink comprising a base, a heat dissipation fins group extending from the base, and a cover contacting with the heat
dissipation fins group, the heat dissipation fins group defining a notch at one side thereof, two end portions of the at least
one heat pipe respectively contacting with the base and the cover, a middle portion of the heat pipe being accommodated in
the notch;
wherein said notch comprises a first section and a second section, the first section shorter than the second section along
a lateral direction, the first section having an inner portion larger than that of the second section for accommodating a
turning corner of a connection section of the at least one heat pipe connecting the middle portion and the end portion contacting
with the base.
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