| US 7,403,393 B2 | ||
| Apparatus and system for cooling heat producing components | ||
| Dean Frederick Herring, Youngsville, N.C. (US); Vinod Kamath, Raleigh, N.C. (US); and Paul Andrew Wormsbecher, Apex, N.C. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/319,315. | ||
| Prior Publication US 2007/0146996 A1, Jun. 28, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—700 [165/104.33; 257/719; 361/719] | 20 Claims |
| 1. An apparatus to cool a heat producing component, the apparatus comprising:
a mounting plate rigidly connected with a top surface of a circuit board, the mounting plate positioned above a heat producing
component mounted on the circuit board;
a heat sink having first and second ends, the heat sink configured to interface with the mounting plate in order to provide
a downward force on the heat producing component; and
a bellows device coupling a heat transfer tip with the first end of the heat sink, the bellows device configured to transfer
the downward force from the mounting plate to a top surface of the heat producing component and maintain the heat transfer
tip in compliance with the plane of the top surface of the heat producing component.
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