| US 7,402,759 B2 | ||
| Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board | ||
| Daigo Suzuki, Oume (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on May 06, 2005, as Appl. No. 11/123,154. | ||
| Claims priority of application No. 2004-160327 (JP), filed on May 28, 2004. | ||
| Prior Publication US 2005/0263319 A1, Dec. 01, 2005 | ||
| Int. Cl. H01R 12/04 (2006.01); H05K 1/11 (2006.01) | ||
| U.S. Cl. 174—262 [174/254; 360/323] | 19 Claims |
| 1. A printed circuit board, comprising:
an insulating substrate including a first area corresponding to a printed circuit board body and a second area corresponding
to a printed circuit board connecting portion which connects to the printed circuit board body;
a first wiring disposed on a main surface of the insulating substrate in the second area;
a first insulating film disposed in the first and second areas while covering the first wiring;
a first interlayer connecting portion extending through the first insulating film, disposed near a boundary between the first
and second areas, and electrically connecting to the first wiring;
a second interlayer connecting portion extending through the first insulating film, disposed near an end portion of the second
area, and electrically connecting to the first wiring;
a second wiring disposed on the first insulating film in the first area and electrically connecting to the first interlayer
connecting portion; and
a first terminal disposed at the end portion of the second area and electrically connecting to the second interlayer connecting
portion.
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