| US 7,402,220 B2 | ||
| Method for manufacturing multi-layered unit for multi-layered ceramic electronic component | ||
| Syougo Murosawa, Tokyo (Japan); Shigeki Sato, Tokyo (Japan); and Masaaki Kanasugi, Tokyo (Japan) | ||
| Assigned to TDK Corporation, Tokyo (Japan) | ||
| Appl. No. 10/553,536 PCT Filed Apr. 12, 2004, PCT No. PCT/JP2004/005200 § 371(c)(1), (2), (4) Date Oct. 17, 2005, PCT Pub. No. WO2004/095479, PCT Pub. Date Nov. 04, 2004. |
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| Claims priority of application No. 2003-113832 (JP), filed on Apr. 18, 2003. | ||
| Prior Publication US 2006/0254701 A1, Nov. 16, 2006 | ||
| Int. Cl. B32B 37/12 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01) | ||
| U.S. Cl. 156—89.12 [156/89.16; 156/235; 156/241; 156/289] | 17 Claims |
| 1. A method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component comprising:
a step of forming a ceramic green sheet on the surface of a first carrier film;
a step of forming a release layer on the surface of a second carrier film including a surface-treated region on which a surface
treatment is performed for improving releasability and a non-surface-treated regions on which no surface treatment is performed
on both sides of the surface-treated region and having a width substantially equal to that of the first carrier film;
a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the
electrode layer on the surface of the release layer, thereby forming an inner electrode layer;
a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the
second carrier film;
a step of bringing the surface of the adhesive layer formed on the third carrier film and the surface of the inner electrode
layer into close contact with each other and pressing them, thereby bonding the adhesive layer onto the surface of the inner
electrode layer;
a step of peeling off the third carrier film from the adhesive layer;
a step of pressing and bonding the ceramic green sheet formed on the surface of the first carrier film and the inner electrode
layer formed on the surface of the second carrier film onto each other via the adhesive layer; and
a step of peeling off the first carrier film from the ceramic green sheet, thereby fabricating a multi-layered unit including
the ceramic green sheet and the inner electrode layer laminated onto each other,
wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that
the width of the adhesive layer is:
narrower than the width of the third carrier film by at least 2α, wherein the third carrier film is conveyed by a sheet conveying
mechanism and α is a positive value defined as the maximum width within which one side of a sheet may meander when the sheet
is conveyed by the sheet conveying mechanism and is a value inherent to the sheet conveying mechanism;
wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release
layer and the inner electrode layer formed on the surface of the second carrier film by at least 2α; and
wider than the width of the surface-treated region of the second carrier film by at least 2α.
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