US 11,706,969 B2
Method for patterning a coating on a surface and device including a patterned coating
Yi-Lu Chang, Scarborough (CA); Qi Wang, North York (CA); Michael Helander, Toronto (CA); Jacky Qiu, Toronto (CA); Zhibin Wang, Toronto (CA); and Thomas Lever, Toronto (CA)
Assigned to OTI Lumionics Inc., Mississauga (CA)
Filed by OTI Lumionics Inc., Toronto (CA)
Filed on May 12, 2021, as Appl. No. 17/318,961.
Application 17/318,961 is a continuation of application No. 16/279,930, filed on Feb. 19, 2019, granted, now 11,088,327.
Application 16/279,930 is a continuation of application No. 15/527,702, granted, now 10,270,033, previously published as PCT/IB2016/056442, filed on Oct. 26, 2016.
Claims priority of provisional application 62/377,429, filed on Aug. 19, 2016.
Claims priority of provisional application 62/373,927, filed on Aug. 11, 2016.
Claims priority of provisional application 62/277,989, filed on Jan. 13, 2016.
Claims priority of provisional application 62/246,597, filed on Oct. 26, 2015.
Prior Publication US 2021/0280790 A1, Sep. 9, 2021
Int. Cl. H01L 51/00 (2006.01); H10K 71/00 (2023.01); C09K 11/06 (2006.01); G02B 1/18 (2015.01); H10K 30/82 (2023.01); H10K 50/814 (2023.01); H10K 50/824 (2023.01); H10K 50/828 (2023.01); H10K 59/12 (2023.01); H10K 71/16 (2023.01); H10K 30/81 (2023.01); H10K 50/82 (2023.01); H10K 50/822 (2023.01); H10K 59/35 (2023.01); H10K 85/30 (2023.01); H10K 102/00 (2023.01)
CPC H10K 71/621 (2023.02) [C09K 11/06 (2013.01); G02B 1/18 (2015.01); H10K 30/82 (2023.02); H10K 50/814 (2023.02); H10K 50/824 (2023.02); H10K 50/828 (2023.02); H10K 59/12 (2023.02); H10K 71/166 (2023.02); H10K 30/81 (2023.02); H10K 50/82 (2023.02); H10K 50/822 (2023.02); H10K 59/352 (2023.02); H10K 59/353 (2023.02); H10K 85/324 (2023.02); H10K 2102/3026 (2023.02); H10K 2102/351 (2023.02)] 46 Claims
OG exemplary drawing
 
1. A device having a plurality of layers, extending substantially transverse to a lateral aspect of the device, the lateral aspect comprising a first region and a second region, wherein the layers comprise:
a substrate extending across the first region and the second region; and
a conductive coating supported by the substrate and disposed along the second region only;
wherein the conductive coating is formed by actions comprising:
depositing a nucleation inhibiting coating on the substrate along the first region only; and
subjecting the substrate and the nucleation inhibiting coating to a vapor flux of a conductive coating material for which the nucleation inhibiting coating has a low initial sticking probability, so that the conductive coating forms primarily where the substrate is substantially devoid of the nucleation inhibiting coating.