US 11,706,878 B2
Multilayer circuit board
Yanwen Bai, Shanghai (CN); Shiann-Ming Liou, Shanghai (CN); Gang Zhao, Shanghai (CN); and Lin Chen, Shanghai (CN)
Assigned to INNOGRIT TECHNOLOGIES CO., LTD., Shanghai (CN)
Filed by INNOGRIT TECHNOLOGIES CO., LTD., Shanghai (CN)
Filed on Jun. 18, 2021, as Appl. No. 17/351,664.
Claims priority of application No. 202110012964.8 (CN), filed on Jan. 6, 2021.
Prior Publication US 2022/0217851 A1, Jul. 7, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01); H01L 23/15 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01)
CPC H05K 3/4688 (2013.01) [H05K 1/0251 (2013.01); H05K 1/116 (2013.01); H05K 3/0094 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09518 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer circuit board, comprising:
a plurality of metal layers, a blind via and a buried via, wherein the multilayer circuit board is configured to transmit signals between different ones of the metal layers through a metal line of the corresponding metal layers and the blind via or the buried via, wherein the blind via includes a pad disposed on a non-opening side of the blind via, and the buried via includes a pad disposed on each of an upper orifice and a lower orifice thereof, wherein
an upper or lower metal layer on the non-opening side of the blind via that is adjacent to a metal layer including the blind via has a first hole which is located in a position corresponding to the pad on the non-opening side of the blind via and in a depth direction of the blind via, a projection of the first hole completely covers a projection of the pad on the non-opening side of the blind via on a surface perpendicular to the depth direction of the blind via, wherein the first hole has a diameter that is equal to or larger than a diameter of the pad on the non-opening side of the blind via;
an upper and/or lower metal layer that is adjacent to a metal layer including the buried via has a second hole which is located in a position corresponding to the pad of the upper orifice and/or the lower orifice of the buried via and in a depth direction of the buried via, a projection of the second hole completely covers a projection of the pad on the upper orifice or lower orifice of the buried via on a surface perpendicular to the depth direction of the buried via, wherein the second hole has a diameter that is equal to or larger than a diameter of the pad on the upper orifice and/or the lower orifice of the buried via.