US 11,706,870 B2
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
Joel Goergen, Soulsbyville, CA (US); Jessica Kiefer, San Jose, CA (US); Alpesh Umakant Bhobe, Sunnyvale, CA (US); Kameron Rose Hurst, Sonora, CA (US); D. Brice Achkir, Livermore, CA (US); Amendra Koul, San Francisco, CA (US); Scott Hinaga, Palo Alto, CA (US); and David Nozadze, San Jose, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Oct. 18, 2021, as Appl. No. 17/503,690.
Application 17/503,690 is a continuation of application No. 17/006,016, filed on Aug. 28, 2020.
Claims priority of provisional application 63/016,523, filed on Apr. 28, 2020.
Prior Publication US 2022/0039257 A1, Feb. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 3/46 (2006.01); H05K 1/09 (2006.01)
CPC H05K 1/09 (2013.01) [H05K 3/4644 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/1545 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a first copper layer and a first carbon layer applied directly to a surface of the first copper layer;
a second copper layer and a second carbon layer applied directly to a surface of the second copper layer; and
an insulating core disposed between the first and second copper layers;
wherein each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core.