CPC H05K 1/09 (2013.01) [H05K 3/4644 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/1545 (2013.01)] | 20 Claims |
1. A structure comprising:
a first copper layer and a first carbon layer applied directly to a surface of the first copper layer;
a second copper layer and a second carbon layer applied directly to a surface of the second copper layer; and
an insulating core disposed between the first and second copper layers;
wherein each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core.
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