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1. An oven comprising: a cooking chamber configured to receive a food product; and a radio frequency (RF) heating system configured to provide RF energy into the cooking chamber using solid state electronic components to heat the food product, wherein the solid state electronic components include power amplifier electronics configured to provide a signal into the cooking chamber via a launcher assembly operably coupled to the cooking chamber via a waveguide assembly, wherein the power amplifier electronics are configured to control application of RF energy into the cooking chamber at least in part based on a learning procedure that generates a power cycling between high and low powers to determine an efficient combination of frequency and phase for application of the RF energy into the cooking chamber when the learning procedure is executed, wherein the power amplifier electronics include: a semiconductor die on which one or more RF power transistors are fabricated, an output matching network configured to provide impedance matching between the semiconductor die and external components operably coupled to an output tab, and a bonding ribbon that is bonded at terminal ends thereof to operably couple the one or more RF power transistors of the semiconductor die to the output matching network, and wherein the bonding ribbon has a width of greater than about five times a thickness of the bonding ribbon.
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