CPC H04R 3/007 (2013.01) [H03F 3/187 (2013.01); H03G 3/3005 (2013.01); H03F 2200/03 (2013.01); H03G 2201/103 (2013.01)] | 20 Claims |
1. An apparatus, comprising:
a speaker; and
a chip electrically coupled to the speaker by an electrical connection, wherein the chip comprises:
a processor configured to generate a signal;
an amplifier element on the chip, the amplifier element configured to amplify the signal into an amplified signal, wherein the amplifier element is located at least one of:
in direct contact with terminals of the speaker; or
a distance away from the terminals of the speaker, wherein a software resistance compensation module is used to compensate for resistance from a connection element that connects the amplifier element and the speaker;
a current monitor on the chip, the current monitor configured to monitor a current of the amplified signal prior to the amplified signal being output from the chip to the speaker;
a voltage monitor on the chip, the voltage monitor configured to monitor a voltage of the amplified signal prior to the amplified signal being output from the chip to the speaker; and
wherein the processor of the chip is configured to control a power of the amplified signal output from the chip to the speaker based at least on the current and the voltage.
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