US 11,706,519 B2
Camera module and optical device comprising same
Min Soo Kim, Seoul (KR); In Hoe Kim, Seoul (KR); Hyun Ah Oh, Seoul (KR); Sung Il Lee, Seoul (KR); and Jong Ho Chung, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jul. 14, 2022, as Appl. No. 17/864,680.
Application 17/864,680 is a continuation of application No. 16/982,504, granted, now 11,418,687, previously published as PCT/KR2019/003108, filed on Mar. 18, 2019.
Claims priority of application No. 10-2018-0031895 (KR), filed on Mar. 20, 2018.
Prior Publication US 2022/0353396 A1, Nov. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/57 (2023.01); H04N 23/54 (2023.01); H04N 23/68 (2023.01); G02B 7/09 (2021.01); G02B 27/64 (2006.01); G03B 5/00 (2021.01); G03B 13/36 (2021.01)
CPC H04N 23/57 (2023.01) [G02B 7/09 (2013.01); G02B 27/646 (2013.01); G03B 5/00 (2013.01); G03B 13/36 (2013.01); H04N 23/54 (2023.01); H04N 23/687 (2023.01); G03B 2205/0007 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module, comprising:
a stiffener comprising a protruding portion protruding from an upper surface of the stiffener;
a printed circuit board disposed on the upper surface of the stiffener and comprising a through hole in which the protruding portion of the stiffener is disposed;
an image sensor disposed on an upper surface of the protruding portion of the stiffener; and
a lens barrel disposed above the image sensor,
wherein the upper surface of the protruding portion is positioned lower than an upper surface of the printed circuit board, and
wherein the stiffener is a one-piece member.