US 11,706,516 B2
Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
Mingzhu Wang, Ningbo (CN); Bojie Zhao, Ningbo (CN); Takehiko Tanaka, Ningbo (CN); Feifan Chen, Ningbo (CN); Qimin Mei, Ningbo (CN); Liang Ding, Ningbo (CN); and Heng Jiang, Ningbo (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed on Jul. 1, 2020, as Appl. No. 16/919,065.
Application 16/919,065 is a division of application No. 15/075,192, filed on Mar. 20, 2016, granted, now 10,750,071, issued on Aug. 18, 2020.
Claims priority of application No. 201610142925.9 (CN), filed on Mar. 12, 2016; application No. 201610143457.7 (CN), filed on Mar. 12, 2016; application No. 201610148338.0 (CN), filed on Mar. 15, 2016; and application No. 201610149444.0 (CN), filed on Mar. 15, 2016.
Prior Publication US 2020/0336636 A1, Oct. 22, 2020
Prior Publication US 2022/0345602 A9, Oct. 27, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/57 (2023.01); H01L 27/146 (2006.01); H04N 13/239 (2018.01); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01)
CPC H04N 23/57 (2023.01) [H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 13/239 (2018.05); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H01L 2224/48091 (2013.01); H04N 2213/001 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An array camera module, comprising:
at least two camera lenses, and
a circuit unit which comprises:
at least two photosensitive sensors,
a circuit board portion electrically connecting said at least two photosensitive sensors thereon, wherein the photosensitive sensors are in contact with and supported on an upper surface of the circuit board portion by a bottom surface thereof,
a conjoined encapsulation portion integrally molded on said circuit board portion to support said at least two camera lenses above said at least two photosensitive sensors respectively while said camera lenses are positioned in photosensitive paths of said at least two photosensitive sensors respectively, and
at least two motor connecting structures, each of which comprises at least a connecting element, wherein said connecting elements are mounted in said conjoined encapsulation portion and electrically connected with said circuit board portion.