CPC H04N 23/57 (2023.01) [H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 13/239 (2018.05); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H01L 2224/48091 (2013.01); H04N 2213/001 (2013.01)] | 12 Claims |
1. An array camera module, comprising:
at least two camera lenses, and
a circuit unit which comprises:
at least two photosensitive sensors,
a circuit board portion electrically connecting said at least two photosensitive sensors thereon, wherein the photosensitive sensors are in contact with and supported on an upper surface of the circuit board portion by a bottom surface thereof,
a conjoined encapsulation portion integrally molded on said circuit board portion to support said at least two camera lenses above said at least two photosensitive sensors respectively while said camera lenses are positioned in photosensitive paths of said at least two photosensitive sensors respectively, and
at least two motor connecting structures, each of which comprises at least a connecting element, wherein said connecting elements are mounted in said conjoined encapsulation portion and electrically connected with said circuit board portion.
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