CPC H04N 23/55 (2023.01) [B29C 43/18 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01)] | 20 Claims |
1. A molded photosensitive assembly, characterized by comprising:
an imaging assembly, wherein the imaging assembly includes a circuit board and at least one photosensitive element and a plurality of electronic components, and each electronic component is mounted to the circuit board at intervals;
a molded base, wherein the molded base embeds a part of the imaging assembly, and the molded base has a light window, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base; and
a filter assembly, wherein the filter assembly includes at least one filter element, and each filter element respectively corresponds to each light window of the molded base, and a lower surface of the filter element is lower than a top surface of at least one of the electronic components.
|