CPC H01L 33/62 (2013.01) [H01L 33/486 (2013.01); H01L 2933/0066 (2013.01)] | 2 Claims |
1. A method of manufacturing a light emitting diode module, comprising:
covering a first protecting layer on a first metal layer to form a first conductive device, and covering a second protecting layer on a second metal layer to form a second conductive device;
covering around the first conductive device and around the second conductive device by an insulating structure, wherein the insulating structure comprises a first opening and a second opening;
performing a superficial treatment to the insulating structure, the first protecting layer and the second protecting layer in the first opening and the second opening; and
disposing a first plating layer on the first protecting layer and the second protecting layer in the first opening and the second opening after the superficial treatment.
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