US 11,705,547 B2
Manufacturing method of light emitting diode module
Jian-Tsai Chang, Taoyuan (TW); Chin-Jui Yu, Taoyuan (TW); and Jheng-Dong Huang, Taoyuan (TW)
Assigned to Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed by Jentech Precision Industrial Co., LTD., Taoyuan (TW)
Filed on Mar. 15, 2021, as Appl. No. 17/200,926.
Claims priority of application No. 109116963 (TW), filed on May 21, 2020.
Prior Publication US 2021/0367123 A1, Nov. 25, 2021
Int. Cl. H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 33/62 (2013.01) [H01L 33/486 (2013.01); H01L 2933/0066 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method of manufacturing a light emitting diode module, comprising:
covering a first protecting layer on a first metal layer to form a first conductive device, and covering a second protecting layer on a second metal layer to form a second conductive device;
covering around the first conductive device and around the second conductive device by an insulating structure, wherein the insulating structure comprises a first opening and a second opening;
performing a superficial treatment to the insulating structure, the first protecting layer and the second protecting layer in the first opening and the second opening; and
disposing a first plating layer on the first protecting layer and the second protecting layer in the first opening and the second opening after the superficial treatment.