US 11,705,423 B2
Package structure
Sung-Feng Yeh, Taipei (TW); Hsien-Wei Chen, Hsinchu (TW); and Ming-Fa Chen, Taichung (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 8, 2022, as Appl. No. 17/834,945.
Application 16/576,786 is a division of application No. 15/983,064, filed on May 17, 2018, granted, now 10,475,762, issued on Nov. 12, 2019.
Application 17/834,945 is a continuation of application No. 17/015,039, filed on Sep. 8, 2020, granted, now 11,387,209.
Application 17/015,039 is a continuation of application No. 16/576,786, filed on Sep. 20, 2019, granted, now 10,797,015, issued on Oct. 6, 2020.
Prior Publication US 2022/0302070 A1, Sep. 22, 2022
Int. Cl. H01L 21/306 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/3105 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 24/33 (2013.01) [H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/561 (2013.01); H01L 21/76898 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 25/50 (2013.01); H01L 24/13 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/33051 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a first die;
a first dielectric layer, covering a bottom surface of the first die, wherein the first dielectric layer comprises a first edge portion and a first center portion in contact with the bottom surface of the first die;
a second dielectric layer, disposed on the first dielectric layer and laterally surrounding the first die, wherein the second dielectric layer comprises a second edge portion and a second center portion, the second edge portion is located on the first edge portion, and the second edge portion is thinner than the second center portion; and
a carrier, bonded to the first dielectric layer through a bonding film.