US 11,705,409 B2
Semiconductor device having antenna on chip package and manufacturing method thereof
Albert Wan, Hsinchu (TW); Ching-Hua Hsieh, Hsinchu (TW); Chao-Wen Shih, Hsinchu County (TW); Han-Ping Pu, Taichung (TW); Meng-Tse Chen, Pingtung County (TW); and Sheng-Hsiang Chiu, Tainan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 29, 2020, as Appl. No. 16/916,066.
Application 16/916,066 is a division of application No. 15/965,995, filed on Apr. 30, 2018, granted, now 10,741,508.
Prior Publication US 2020/0335459 A1, Oct. 22, 2020
Int. Cl. H01L 23/66 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/5226 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a chip package;
a dielectric structure disposed on the chip package, the dielectric structure comprising a first layer, a second layer disposed between the chip package and the first layer and comprising a cavity, and a vent in communication with the cavity, wherein the first layer covers the cavity, wherein the vent is an air vent; and
a first antenna pattern disposed on the dielectric structure, wherein the chip package is electrically coupled to the first antenna pattern, and the cavity of the dielectric structure is disposed between the chip package and the first antenna pattern.