CPC H01L 23/5283 (2013.01) [H01L 23/49838 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 24/17 (2013.01); H01L 24/23 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01)] | 17 Claims |
1. A semiconductor package comprising:
a first die comprising a plurality of interconnects having an average pitch between adjacent interconnects, and the first die having a footprint;
a second die comprising a plurality of interconnects having an average pitch between adjacent interconnects smaller than the average pitch between adjacent interconnects of the first die, and the second die having a footprint;
a bridge die comprising a first contact area to connect to the first die and a second contact area to connect to the second die, the bridge die comprising a plurality of interconnect layers, wherein the plurality of interconnects of the first die are connected to the plurality of interconnects of the second die by the plurality of interconnect layers, and wherein the bridge die has a footprint smaller than the footprint of the first die and smaller than the footprint of the second die.
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