| CPC H01L 21/6715 (2013.01) [H01L 21/0273 (2013.01); H01L 21/67051 (2013.01)] | 6 Claims |
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1. An apparatus for treating a substrate, the apparatus comprising:
a chuck configured to hold the substrate;
a plurality of nozzles configured to dispense a liquid onto the substrate, which is supported on the chuck, to remove a photoresist film on the substrate; and
a controller configured to control the plurality of nozzles, wherein the plurality of nozzles includes:
a solvent nozzle configured to move, toward a center of the substrate, from a standby position to a process position to dispense an organic solvent; and
an ozone nozzle configured to move, toward the center of the substrate, from an other standby position to the process position to dispense a liquid containing ozone; and
a lamp disposed adjacent to the ozone nozzle to irradiate UV light on the substrate, while the ozone nozzle dispenses the liquid containing ozone, to generate hydroxyl radicals from the liquid containing ozone, and
wherein the controller is programmed to control the plurality of nozzles such that, depending on whether the photoresist film has ions implanted therein, the solvent nozzle moves to the process position to dispense the organic solvent onto the substrate to remove the photoresist film, or the ozone nozzle moves with the lamp to the process position to dispense the liquid containing the ozone to remove organic residue on the substrate.
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