US 11,703,922 B2
Thermal interface material structures for directing heat in a three-dimensional space
Mark K. Hoffmeyer, Rochester, MN (US); Christopher M. Marroquin, Rochester, MN (US); Eric J. Campbell, Rochester, MN (US); Sarah K. Czaplewski-Campbell, Rochester, MN (US); and Phillip V. Mann, Rochester, MN (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 29, 2022, as Appl. No. 17/852,711.
Application 17/852,711 is a division of application No. 16/847,144, filed on Apr. 13, 2020, granted, now 11,416,045.
Prior Publication US 2022/0334625 A1, Oct. 20, 2022
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC G06F 1/20 (2013.01) [H05K 7/20481 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A system comprising:
a circuit board comprising a first component having a first load requirement and a second component having a second load requirement;
a heat exchanger; and
a thermal interface material (TIM) sheet comprising:
a lower portion positioned between and in thermal contact with the first component and the heat exchanger, wherein the lower portion is not compressed;
a first upper portion positioned between and in thermal contact with the heat exchanger and the second component; and
a first side portion connecting the lower portion to the first upper portion.