US 11,703,921 B2
Configurable heatsink
Michael L. Sabotta, Cypress, TX (US); Susheela N. Narasimhan, Fremont, CA (US); Reza Azizian, San Jose, CA (US); and Herman W. Chu, Palo Alto, CA (US)
Assigned to Nvidia Corporation, Santa Clara, CA (US)
Filed by NVIDIA Corporation, Santa Clara, CA (US)
Filed on Mar. 9, 2020, as Appl. No. 16/813,590.
Prior Publication US 2021/0278885 A1, Sep. 9, 2021
Int. Cl. G06F 1/20 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/20 (2013.01) [H05K 7/20154 (2013.01); H05K 7/20209 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A system, comprising:
one or more processors;
a heatsink connected by a flexible heat conduit to the one or more processors; and
a support comprising a plurality of slots, each slot of the plurality of slots to secure the heatsink in a respective position of a plurality of positions via a connector pin of the heatsink.