US 11,703,642 B2
Protective ring structure to increase waveguide performance
Yung-Chang Chang, Taipei (TW); and Meng-Han Lin, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed on May 3, 2022, as Appl. No. 17/735,383.
Application 17/735,383 is a division of application No. 16/806,043, filed on Mar. 2, 2020, granted, now 11,333,827.
Prior Publication US 2022/0260777 A1, Aug. 18, 2022
Int. Cl. G02B 6/124 (2006.01); H01L 23/48 (2006.01); G02B 6/136 (2006.01); G02B 6/12 (2006.01)
CPC G02B 6/124 (2013.01) [G02B 6/136 (2013.01); H01L 23/48 (2013.01); G02B 6/12002 (2013.01); G02B 6/12004 (2013.01); G02B 6/12019 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for forming an integrated chip, the method comprising:
forming a waveguide on a first surface of a substrate;
forming a conductive structure at least partially overlying the waveguide; and
forming a light pipe structure over the waveguide, wherein a lower surface of the light pipe structure is disposed between a top surface and a bottom surface of the conductive structure, and wherein a lower portion of the light pipe structure contacts the conductive structure.