CPC G01R 1/073 (2013.01) [G01R 31/2887 (2013.01); G01R 31/2891 (2013.01)] | 3 Claims |
1. A probing system for testing a wafer, comprising:
a vacuum suction nozzle configured to suck the wafer;
an electrical testing substrate, wherein the electrical testing substrate comprises a plurality of probes for inspecting the wafer with a contact pressure, and a through hole for arranging the vacuum suction nozzle for moving the wafer vertically; and
a platform configured to fix the wafer, wherein the platform and the vacuum suction nozzle are discrete, the vacuum suction nozzle sucks a movable part, and the platform fixes a fixed part of the wafer.
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