US 11,703,524 B2
Probing system for discrete wafer
Wen-Yuan Hsu, Hsinchu (TW); Chi-Ming Yang, Hsinchu (TW); Sih-Ying Chang, Hsinchu (TW); Tsung-Po Lee, Hsinchu (TW); and Kee-Leong Yu, Hsinchu (TW)
Assigned to HERMES TESTING SOLUTIONS INC., Hsinchu (TW)
Filed by Hermes Testing Solutions Inc., Hsinchu (TW)
Filed on Nov. 1, 2021, as Appl. No. 17/516,271.
Claims priority of application No. 109140651 (TW), filed on Nov. 20, 2020.
Prior Publication US 2022/0163563 A1, May 26, 2022
Int. Cl. G01R 1/073 (2006.01); G01R 31/28 (2006.01)
CPC G01R 1/073 (2013.01) [G01R 31/2887 (2013.01); G01R 31/2891 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A probing system for testing a wafer, comprising:
a vacuum suction nozzle configured to suck the wafer;
an electrical testing substrate, wherein the electrical testing substrate comprises a plurality of probes for inspecting the wafer with a contact pressure, and a through hole for arranging the vacuum suction nozzle for moving the wafer vertically; and
a platform configured to fix the wafer, wherein the platform and the vacuum suction nozzle are discrete, the vacuum suction nozzle sucks a movable part, and the platform fixes a fixed part of the wafer.