US 11,703,475 B2
Method of using integrated electro-microfluidic probe card
Yi-Shao Liu, Zhubei (TW); Fei-Lung Lai, New Taipei (TW); Chun-Ren Cheng, Hsinchu (TW); and Chun-Wen Cheng, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Sep. 30, 2019, as Appl. No. 16/588,088.
Application 15/350,399 is a division of application No. 13/673,602, filed on Nov. 9, 2012, granted, now 9,523,642, issued on Dec. 20, 2016.
Application 16/588,088 is a continuation of application No. 15/350,399, filed on Nov. 14, 2016, granted, now 10,429,341.
Prior Publication US 2020/0025713 A1, Jan. 23, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 27/414 (2006.01); G01N 21/75 (2006.01); G01N 33/543 (2006.01); G01N 27/327 (2006.01); B01L 3/00 (2006.01); B01L 9/00 (2006.01)
CPC G01N 27/4145 (2013.01) [B01L 3/502707 (2013.01); B01L 9/527 (2013.01); G01N 21/75 (2013.01); G01N 27/3275 (2013.01); G01N 33/5438 (2013.01); B01L 2200/025 (2013.01); B01L 2200/027 (2013.01); B01L 2200/10 (2013.01); B01L 2200/143 (2013.01); B01L 2300/0645 (2013.01); G01N 27/3271 (2013.01); Y10T 29/49 (2015.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
mounting an integrated electro-microfluidic probe card to a device area on a bio-sensor device wafer, wherein the electro-microfluidic probe card has a first major surface and a second major surface opposite the first major surface, and the electro-microfluidic probe card comprises a transparent portion;
electrically connecting at least one electronic probe tip extending from the first major surface to a corresponding conductive area of the device area;
stamping a test fluid onto the device area, wherein the stamped test fluid is removable;
measuring via the at least one electronic probe tip a first electrical property of one or more bio-FETs of the device area based on the test fluid; and
flushing the stamped test fluid to remove the stamped test fluid from the device area.