CPC C08L 63/00 (2013.01) [B29C 43/003 (2013.01); B29C 43/10 (2013.01); H01L 23/295 (2013.01); B29C 2043/106 (2013.01); B29K 2463/00 (2013.01); C08K 3/013 (2018.01); C08K 5/0025 (2013.01); C08L 2310/00 (2013.01)] | 11 Claims |
1. A tablet form of an epoxy resin composition for encapsulation of semiconductor elements,
wherein the tablet form of the epoxy resin composition
(i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve,
(ii) satisfies the following Equation 1:
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and
(iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.
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