US 11,702,537 B2
Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same
Sang Jin Kim, Suwon-si (KR); Sang Kyun Kim, Suwon-si (KR); Tae Shin Eom, Suwon-si (KR); Dong Hwan Lee, Suwon-si (KR); Young Joon Lee, Suwon-si (KR); and Yong Han Cho, Suwon-si (KR)
Assigned to SAMSUNG SDI CO., LTD., Yongin-si (KR)
Filed by SAMSUNG SDI CO., LTD., Yongin-si (KR)
Filed on Dec. 20, 2019, as Appl. No. 16/722,670.
Application 16/722,670 is a continuation of application No. PCT/KR2018/005509, filed on May 14, 2018.
Claims priority of application No. 10-2017-0078798 (KR), filed on Jun. 21, 2017.
Prior Publication US 2020/0140677 A1, May 7, 2020
Int. Cl. C08L 63/00 (2006.01); B29C 43/00 (2006.01); B29C 43/10 (2006.01); H01L 23/29 (2006.01); C08K 3/013 (2018.01); B29K 463/00 (2006.01); C08K 5/00 (2006.01)
CPC C08L 63/00 (2013.01) [B29C 43/003 (2013.01); B29C 43/10 (2013.01); H01L 23/295 (2013.01); B29C 2043/106 (2013.01); B29K 2463/00 (2013.01); C08K 3/013 (2018.01); C08K 5/0025 (2013.01); C08L 2310/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A tablet form of an epoxy resin composition for encapsulation of semiconductor elements,
wherein the tablet form of the epoxy resin composition
(i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve,
(ii) satisfies the following Equation 1:

OG Complex Work Unit Math
where σD is a standard deviation of tablet diameters and σH is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and
(iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.