	US 11,702,520 B2
	Epoxy resin composition for molding semiconductor, molding film and semiconductor package using the same
Minsu Jeong, Daejeon (KR); You Jin Kyung, Daejeon (KR); Byung Ju Choi, Daejeon (KR); Woo Jae Jeong, Daejeon (KR); Kwang Joo Lee, Daejeon (KR); and Eunbyurl Cho, Daejeon (KR)
Assigned to LG CHEM, LTD., Seoul (KR)
Appl. No. 16/767,808
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Jan. 9, 2019, PCT No. PCT/KR2019/000353 § 371(c)(1), (2) Date May 28, 2020, PCT Pub. No. WO2019/139354, PCT Pub. Date Jul. 18, 2019.
Claims priority of application No. 10-2018-0004041 (KR), filed on Jan. 11, 2018; and application No. 10-2019-0001976 (KR), filed on Jan. 7, 2019.
Prior Publication US 2020/0347194 A1, Nov. 5, 2020
Int. Cl. C08J 5/18 (2006.01); C08G 59/14 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01)

CPC C08J 5/18 (2013.01) [C08G 59/14 (2013.01); C08K 3/36 (2013.01); H01L 23/295 (2013.01); C08J 2363/00 (2013.01); C08K 2201/003 (2013.01)]

6 Claims

1. An epoxy resin composition for molding a semiconductor, comprising:

an epoxy resin containing an epoxy structure represented by Chemical Formula 1 and an epoxy compound represented by Chemical Formula 2; and

50% by weight or more and 90% by weight or less of an inorganic filler:

wherein, in the Chemical Formula 1, R is an alkyl group having 1 to 20 carbon atoms or a cycloalkyl group having 3 to 20 carbon atoms, n is an integer from 1 to 30, C₁is a cycloalkane having 3 to 10 carbon atoms, and L₁is a direct bond or an alkylene group having 1 to 10 carbon atoms,

wherein, in the Chemical Formula 2, C₂to C₃are each independently a cycloalkane having 3 to 10 carbon atoms to which an epoxy group is bonded, and L₂is a direct bond or an alkylene group having 1 to 10 carbon atoms, and

wherein the epoxy resin comprises the epoxy compound in an amount of 50 parts by weight or more and 90 parts by weight or less, based on 100 parts by weight of the epoxy structure represented by Chemical Formula 1.