US 11,701,883 B2
Inkjet printhead having robust encapsulation of wirebonds
Elmer Dimaculangan Perez, North Ryde (AU); See-Huat Tan, North Ryde (AU); Glenn Horrocks, North Ryde (AU); Mohammad Hossain, North Ryde (AU); Michael John Webb, North Ryde (AU); Pascal Blanquer, North Ryde (AU); and Erik Coolen, North Ryde (AU)
Assigned to Memjet Technology Limited, Dublin (IE)
Filed by Memjet Technology Limited, Dublin (IE)
Filed on Aug. 11, 2021, as Appl. No. 17/399,818.
Claims priority of provisional application 63/065,329, filed on Aug. 13, 2020.
Prior Publication US 2022/0048289 A1, Feb. 17, 2022
Int. Cl. B41J 2/14 (2006.01)
CPC B41J 2/14016 (2013.01) [B41J 2002/14362 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); B41J 2202/22 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic assembly comprising:
a substrate;
one or more dies mounted on the substrate, each die having a plurality of bond pads;
a PCB mounted on the substrate, the PCB having a plurality of contact pads;
a plurality of wirebonds interconnecting the bond pads and the contact pads, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions;
a dam encapsulant encapsulating each of the first and second end portions, the bond pads and the contact pads;
a first fill encapsulant disposed on the substrate so as to contact at least the substrate and the dam encapsulant; and
a second fill encapsulant disposed on the first encapsulant so as to contact at least the first fill encapsulant and the dam encapsulant;
wherein:
the second fill encapsulant does not contact the substrate;
at least one of the first and second fill encapsulants encapsulates the intermediate sections of the wirebonds; and
the first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.