CPC B41J 2/14016 (2013.01) [B41J 2002/14362 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/19 (2013.01); B41J 2202/22 (2013.01)] | 17 Claims |
1. An electronic assembly comprising:
a substrate;
one or more dies mounted on the substrate, each die having a plurality of bond pads;
a PCB mounted on the substrate, the PCB having a plurality of contact pads;
a plurality of wirebonds interconnecting the bond pads and the contact pads, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions;
a dam encapsulant encapsulating each of the first and second end portions, the bond pads and the contact pads;
a first fill encapsulant disposed on the substrate so as to contact at least the substrate and the dam encapsulant; and
a second fill encapsulant disposed on the first encapsulant so as to contact at least the first fill encapsulant and the dam encapsulant;
wherein:
the second fill encapsulant does not contact the substrate;
at least one of the first and second fill encapsulants encapsulates the intermediate sections of the wirebonds; and
the first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.
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