CPC B24B 37/013 (2013.01) [B24B 37/04 (2013.01); B24B 49/12 (2013.01); H01L 22/12 (2013.01); H01L 22/26 (2013.01)] | 13 Claims |
1. A chemical mechanical polishing apparatus, comprising:
a platen supporting a polishing pad, the platen having a recess, and wherein the polishing pad has a polishing layer and a backing layer, and a pad portion coupled to a remainder of the polishing pad by a material that is softer than the pad portion;
a flexible membrane in the recess, wherein the flexible membrane defines a pressurizable volume in the recess below the flexible membrane, wherein the pressurizable volume is entirely contained within the flexible membrane; and
an in-situ vibration monitoring system to generate a signal, the in-situ vibration monitoring system including a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.
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10. A chemical mechanical polishing apparatus, comprising:
a platen to support a polishing pad, the platen having a recess;
a flexible membrane in the recess which extends across the recess to seal a volume below the flexible membrane and forms a pressurizable chamber;
an in-situ vibration monitoring system to generate a signal, the in-situ vibration monitoring system including a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad; and
a pump to pressurize the chamber and urge the vibration sensor into contact with the underside of the polishing pad.
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12. A chemical mechanical polishing apparatus, comprising:
a platen having a recess, wherein the recess has a bottom surface and sidewalls;
a polishing pad supported on the platen, wherein the polishing pad has a polishing layer and a backing layer, and a pad portion coupled to a remainder of the polishing pad by a material that is softer than the pad portion;
a flexible membrane extending between the sidewalls of the recess, wherein the flexible membrane defines a pressurizable volume between the bottom of the recess and the flexible membrane; and
an in-situ vibration monitoring system to generate a signal, the in-situ vibration monitoring system including a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.
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