CPC B23D 61/04 (2013.01) [G06K 7/0091 (2013.01); G06K 19/07769 (2013.01); H01L 23/49855 (2013.01)] | 20 Claims |
1. A chip fraud prevention system, comprising:
a housing comprising a chip pocket, the chip pocket configured to at least partially encompass an integrated circuit, the chip pocket comprising a peak and a valley; and
a connection configured to communicatively couple to the integrated circuit, the connection placed between the peak and the valley,
wherein the peak and the valley create an uneven surface within the housing chip pocket.
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