US 11,701,059 B2
Integrated circuit medical devices and method
Scott P. Carpenter, Fremont, CA (US)
Assigned to Vactronix Scientific, LLC., San Antonio, TX (US)
Filed by Vactronix Scientific, LLC, Fremont, CA (US)
Filed on Apr. 4, 2022, as Appl. No. 17/713,130.
Application 17/713,130 is a continuation of application No. 16/781,932, filed on Feb. 4, 2020, granted, now 11,291,412, issued on Apr. 5, 2022.
Claims priority of provisional application 62/801,018, filed on Feb. 4, 2019.
Prior Publication US 2022/0296167 A1, Sep. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 5/00 (2006.01); A61F 2/91 (2013.01); H01L 21/02 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); A61B 5/30 (2021.01)
CPC A61B 5/6862 (2013.01) [A61B 5/30 (2021.01); A61B 5/4064 (2013.01); A61B 5/6868 (2013.01); A61F 2/91 (2013.01); H01L 21/02266 (2013.01); H01L 23/293 (2013.01); H01L 23/3178 (2013.01); A61F 2210/0014 (2013.01); A61F 2210/0076 (2013.01); A61F 2240/001 (2013.01); A61F 2250/0096 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method of making an integrated circuit medical device having an electrically conductive framework support member with a thickness, a first end and a second end, and a plurality of slots passing through the thickness of the framework support member, the plurality of slots defining a plurality of circuit traces being each bounded by the plurality of slots and an insulating layer covering the framework support member, filling the plurality of slots, wherein at least a portion of the plurality of circuit traces are exposed through the insulating layer, comprising the steps of:
a. depositing a layer of an electrically conductive material onto a substrate forming a framework support member;
b. forming a plurality of slots passing through the framework support member and to the substrate thereby defining a plurality of circuit traces bounded by the plurality of slots; and
c. coating a dielectric layer onto the framework support member and plurality of traces thereby filling the plurality of slots and binding the plurality of circuit traces to the framework support member wherein the plurality of circuit traces are electrically isolated from the framework support member.