US 7,565,592 B2
Failure analysis and testing of semi-conductor devices using intelligent software on automated test equipment (ATE)
Roger Yacobucci, Fort Collins, Colo. (US)
Assigned to LSI Corporation, Milpitas, Calif. (US)
Filed on Dec. 27, 2007, as Appl. No. 11/964,920.
Application 11/964920 is a division of application No. 11/670031, filed on Feb. 01, 2007, granted, now 7,430,700.
Application 11/670031 is a division of application No. 11/028695, filed on Jan. 04, 2005, granted, now 7,203,877.
Prior Publication US 2008/0162070 A1, Jul. 03, 2008
Int. Cl. G01R 31/30 (2006.01); G01R 31/08 (2006.01)
U.S. Cl. 714—745  [324/522] 3 Claims
OG exemplary drawing
 
1. A method to curve trace device buffers on an ATE, said method comprising the steps of:
a) defining a predetermined pin list which is set to include all pins during pattern loads;
b) modifying said predetermined pin list using a predetermined debugger command in order to include desired pins for characterization using an appropriate computer program;
c) having said appropriate computer program query a user regarding a plurality of items;
d) reading one of said pins from said predetermined pin list;
e) using pin measurement units to force incrementally increasing voltage from zero volts until a predefined maximum current limit is reached;
f) flagging any problem pins identified in step (e) and storing values at each increment to data files;
g) using pin measurement units to force incrementally decreasing voltage from zero to a predefined minimum current limit is reached;
h) flagging any problem pins identified in step (g) and storing values at each increment to data files; and
i) if all of said pins in said predetermined pin list have not been evaluated, returning to step (d).