| US 7,565,002 B2 | ||
| Wafer surface observation apparatus | ||
| Hiroyuki Yasutomi, Mitaka (Japan); Mikio Sakuma, Mitaka (Japan); and Hirofumi Shimoda, Mitaka (Japan) | ||
| Assigned to Tokyo Seimitsu Co., Ltd., Tokyo (Japan) | ||
| Appl. No. 10/493,865 PCT Filed Nov. 06, 2001, PCT No. PCT/JP01/09679 § 371(c)(1), (2), (4) Date Dec. 20, 2004, PCT Pub. No. WO03/041159, PCT Pub. Date May 15, 2003. |
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| Prior Publication US 2005/0105790 A1, May 19, 2005 | ||
| Int. Cl. G06K 9/00 (2006.01) | ||
| U.S. Cl. 382—151 [382/145; 382/152] | 4 Claims |
| 1. A dicing apparatus, characterized in that the apparatus comprises:
image pickup means for picking up image of the surface of the wafer,
display means for displaying an image picked up by the imaging means,
input means using a pointing device for inputting position information by designating an arbitrary position displayed by the
display means, by using a position on a display,
shape detecting means for detecting reference information of a straight street pattern shape which is formed on the wafer
surface according to the image picked up by the imaging means,
storage means for storing the reference information of the straight street pattern shape detected by the shape detecting means
and one or a plurality of reference position(s) of the straight street pattern shape formed on the wafer surface,
conversion means for converting the inputted position information into a position closest from the inputted position information
out of the straight street pattern shape detected by the shape detecting means, or the position closest to the input position
information out of the one or a plurality of reference position(s) of the straight street pattern shape formed on the wafer
surface, according to the reference information, and
moving means for moving a display position into the converted position in response to the inputted position information, wherein
after the straight street pattern shape closest to the position designated by the input means is matched to the center position
of an image picked up by the imaging means, manual alignment is performed with manual operation to adjust the straight street
pattern shape formed on the wafer surface and the movement direction during processing to be parallel, by moving the wafer
to a position where the wafer edge is picked up by the imaging means in an axial moving direction at processing; and at the
moved position, the edge position of the straight street pattern shape closest to the position designated by the input means
which has been matched to the center position of the image is determined, and the wafer is rotationally moved according to
the rotation angle calculated by the center position and the edge position.
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