US 7,564,125 B2
Electronic array and methods for fabricating same
William E. Burdick, Jr., Niskayuna, N.Y. (US); James W. Rose, Guilderland, N.Y. (US); Donna M. Sherman, East Greenbush, N.Y. (US); James E. Sabatini, Scotia, N.Y. (US); and George Edward Possin, Niskayuna, N.Y. (US)
Assigned to General Electric Company, Schenectady, N.Y. (US)
Filed on Dec. 06, 2002, as Appl. No. 10/313,078.
Prior Publication US 2004/0109299 A1, Jun. 10, 2004
Int. Cl. H01L 23/02 (2006.01)
U.S. Cl. 257—678  [257/680; 257/685; 257/E23.001; 257/433] 6 Claims
OG exemplary drawing
 
1. A tileable sensor array comprising:
a substrate including a front side and a back side;
a plurality of transducers fabricated on said front side of said substrate, said transducers arranged in a continuous two-dimensional array such that each transducer is butted against at least two adjacent transducers;
a plurality of input/output connections positioned on said back side of said substrate, said input/output connections electrically coupled to said transducers;
at least one electronic device comprising at least one signal processor circuit; and
a flexible metal-on-polyimide interposer positioned between and against said substrate and said electronic device, said flexible interposer comprising a multilayer interconnect system configured to electrically connect said transducers and said input/output connections to said electronic device.