| US 7,564,122 B2 | ||
| Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | ||
| Jae Hak Yee, Seoul (Korea, Republic of); Young Suk Chung, Seoul (Korea, Republic of); Jae Jin Lee, Seoul (Korea, Republic of); Terry Davis, Peoria, Ariz. (US); Chung Suk Han, Seoul (Korea, Republic of); Jae Hun Ku, Seoul (Korea, Republic of); Jae Sung Kwak, Seoul (Korea, Republic of); and Sang Hyun Ryu, Seoul (Korea, Republic of) | ||
| Assigned to Amkor Technology, Inc., Chandler, Ariz. (US) | ||
| Filed on Mar. 01, 2006, as Appl. No. 11/365,246. | ||
| Application 10/667227 is a division of application No. 10/152945, filed on May 22, 2002, granted, now 6,825,062, filed on Nov. 30, 2004. | ||
| Application 10/152945 is a division of application No. 09/444035, filed on Nov. 19, 1999, granted, now 6,448,633, filed on Sep. 10, 2002. | ||
| Application 11/365246 is a continuation of application No. 10/667227, filed on Sep. 18, 2003, granted, now 7,057,280, filed on Jun. 06, 2006. | ||
| Claims priority of application No. 98-49887 (KR), filed on Nov. 20, 1998; application No. 98-52924 (KR), filed on Dec. 03, 1998; and application No. 98-63126 (KR), filed on Dec. 31, 1998. | ||
| Prior Publication US 2008/0036055 A1, Feb. 14, 2008 | ||
| Int. Cl. H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—666 [257/787] | 19 Claims |
| 1. A semiconductor package comprising:
a paddle having multiple sides;
a plurality of leads extending along and in spaced relation to one of the sides of the paddle, each of the leads having:
a lead lower surface; and
an extension which includes an extension lower surface which is recessed relative to the lead lower surface, the leads extending
in generally parallel relation to each other, with at least some of the extensions extending at divergent angles relative
to the leads;
a semiconductor chip mounted to the paddle and electrically connected to at least some of the leads; and
an encapsulant at least partially encapsulating the semiconductor chip and the leads such that each of the extensions is covered
by the encapsulant and at least a portion of the lead lower surface of each of the leads is exposed in the encapsulant.
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