US 7,563,917 B2
Silicon compound and a production process for silicon compound
Mikio Yamahiro, Kanagawa (Japan); Hisao Oikawa, Kanagawa (Japan); Kenya Ito, Kanagawa (Japan); Masami Tanaka, Kanagawa (Japan); Nobumasa Ootake, Kanagawa (Japan); and Kenichi Watanabe, Kanagawa (Japan)
Assigned to Chisso Corporation, Osaka (Japan)
Filed on Sep. 08, 2006, as Appl. No. 11/517,457.
Application 11/517457 is a division of application No. 10/664151, filed on Sep. 17, 2003, granted, now 7,129,370.
Claims priority of application No. 2002-270430 (JP), filed on Sep. 17, 2002; and application No. 2003-053144 (JP), filed on Feb. 28, 2003.
Prior Publication US 2007/0004932 A1, Jan. 04, 2007
Int. Cl. C07F 7/21 (2006.01)
U.S. Cl. 556—460  [556/450; 556/451] 10 Claims
 
1. A silicon compound represented by formula (1), being prepared from a silicon compound represented by formula (2),

OG Complex Work Unit Drawing
wherein: in formula (1), each of seven R1 is independently selected from the group consisting of (a) hydrogen, (b) (ii) 2-methylpropyl, (iii) 2,4,4-trimethylpentyl, (iv) cyclopentyl, (v) cyclohexyl, (vi) trifluoropropyl, (vii) tridecafluoro-1,1,2,2,-tetrahydrooctyl and (viii) unsubstituted phenyl, (c) substituted or unsubstituted aryl and (d) substituted or unsubstituted arylalkyl wherein each hydrogen of the alkenylene may be optionally substituted with fluorine and each —CH2— group of said alkenylene may be optionally replaced with —O— or —CH═CH—; and A2 is a hydroxyl-terminal organic group, and in formula (2), R1 is the same as R1 in formula (1) and A1 is an organic compound having an acyloxy group.