| US 7,563,844 B2 | ||
| Organosilicone resin emulsion composition and article having coating thereof | ||
| Yoshihito Osawa, Usui-gun (Japan); and Akira Yamamoto, Usui-gun (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Jan. 17, 2006, as Appl. No. 11/332,210. | ||
| Claims priority of application No. 2005-015807 (JP), filed on Jan. 24, 2005; and application No. 2005-186264 (JP), filed on Jun. 27, 2005. | ||
| Prior Publication US 2006/0167176 A1, Jul. 27, 2006 | ||
| Int. Cl. C08L 83/04 (2006.01); C08K 5/05 (2006.01) | ||
| U.S. Cl. 524—588 [524/376] | 17 Claims |
| 1. An organosilicone resin emulsion composition, comprising:
(A) 100 parts by weight of an organosilicone resin having the compositional formula: [RSiO3/2]m[R2SiO]n wherein
each R is selected from the group consisting of a methyl group and a phenyl group,
m is a number of 0.2 to 1.0, and
n is a number of 0 to 0.8;
(B) 2 to 50 parts by weight of a water-miscible organic solvent which is a compound having an alkylene oxide unit and has
a Hildebrand solubility parameter value of 8.0 to 11.0;
(C) 1 to 50 parts by weight of an emulsifier; and
(D) 25 to 2,000 parts by weight of water;
said composition being substantially free of an organic solvent other than component (B), wherein the parts by weight of (B),
(C), and (D) are relative to 100 parts by weight of (A).
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