| US 7,563,487 B2 | ||
| Anisotropic electrically conductive film and method of producing the same | ||
| Yasuhito Masuda, Osaka (Japan); Yasuhiro Okuda, Osaka (Japan); Fumihiro Hayashi, Osaka (Japan); and Tsuyoshi Haga, Hyogo (Japan) | ||
| Assigned to Sumitomo Electric Industries, Ltd., Osaka (Japan) | ||
| Appl. No. 10/551,459 PCT Filed Mar. 12, 2004, PCT No. PCT/JP2004/003356 § 371(c)(1), (2), (4) Date Sep. 30, 2005, PCT Pub. No. WO2004/088795, PCT Pub. Date Oct. 14, 2004. |
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| Claims priority of application No. 2003-096173 (JP), filed on Mar. 31, 2003. | ||
| Prior Publication US 2006/0251871 A1, Nov. 09, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B05D 1/00 (2006.01); B05D 1/18 (2006.01) | ||
| U.S. Cl. 427—437 [427/209; 427/560] | 2 Claims |
| 1. A method of making an anisotropic conductive film, wherein conductive parts capable of being afforded with conductiveness
respectively in the film thickness direction are provided independently of each other in a piercing manner from a first surface
to a second surface by adhering conductive metal to resinous parts having porous structure at plural positions in a base film
consisting of a porous polytetrafluoroethylene film,
the method comprising the steps of:
(i) forming a three layer laminated body by fusion-bonding polytetrafluoroethylene films (B) and (C) as mask layers to both
surfaces of a base film consisting of a porous polytetrafluoroethylene film (A);
(ii) infiltrating liquid into porous parts of the laminated body and freezing the liquid;
(iii) forming through-holes in a pattern in the laminated body by using an ultrasonic head having at least one rod at the
tip thereof and pressing the surface of the laminated body with the tip of the rod so as to apply ultrasonic wave energy thereto;
(iv) returning the freezing in the porous parts to liquid by increasing the temperature of the laminated body and removing
the liquid;
(v) adhering catalytic particles for facilitating chemical reduction reaction to porous parts existing in the whole surface,
including the wall surfaces of the through-holes, of the laminated body;
(vi) peeling off the mask layers from both surfaces of the base film; and
(vii) adhering conductive metal by electroless plating to resinous parts having porous structure on the wall surfaces of the
through-holes.
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