| US 7,563,323 B2 | ||
| Substrate treating apparatus | ||
| Kenji Hashinoki, Kyoto (Japan); Satoshi Yamamoto, Kyoto (Japan); and Yasufumi Koyama, Kyoto (Japan) | ||
| Assigned to Dainippon Screen Mfg. Co. Ltd., (Japan) | ||
| Filed on Sep. 16, 2004, as Appl. No. 10/942,180. | ||
| Claims priority of application No. 2003-329925 (JP), filed on Sep. 22, 2003. | ||
| Prior Publication US 2005/0061441 A1, Mar. 24, 2005 | ||
| Int. Cl. B05C 11/00 (2006.01); B05C 13/00 (2006.01); B05C 13/02 (2006.01); B05C 11/02 (2006.01) | ||
| U.S. Cl. 118—66 [118/58; 118/59; 118/69; 118/52] | 12 Claims |
| 3. A substrate treating apparatus for performing a required treatment of substrates, comprising:
a main body of the treating apparatus including a developing section for developing the substrates;
an interface section for transferring the substrates between said main body of the treating apparatus and an exposing apparatus
which is an external apparatus;
heating modules for heating exposed substrates before development; and
cooling means for cooling the substrates heated by said heating modules;
wherein said heating modules are disposed in said main body of the treating apparatus, and
said heating modules includes a heating plate for supporting and heating the substrates, a temporary substrate deposit adjacent
to said heating plate for holding cooled substrates, and a local transport mechanism for exclusive use in transporting the
substrates from said heating plate to said temporary substrate deposit; and
wherein said interface section includes a substrate transport mechanism for transferring the substrates to said temporary
substrate deposit in said heating modules and transferring the cooled substrates held on said temporary substrate deposit
to said developing section.
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