| US 7,560,941 B2 | ||
| Method and system for compensating thermally induced motion of probe cards | ||
| Rod Martens, Livermore, Calif. (US); Benjamin N. Eldridge, Danville, Calif. (US); Gary W. Grube, Pleasanton, Calif. (US); Ken S. Matsubayashi, Fremont, Calif. (US); Richard A. Larder, Livermore, Calif. (US); Makarand S. Shinde, Livermore, Calif. (US); and Gaetan L. Mathieu, Varennes (Canada) | ||
| Assigned to FormFactor, Inc., Livermore, Calif. (US) | ||
| Filed on Oct. 10, 2006, as Appl. No. 11/548,183. | ||
| Application 11/216579 is a division of application No. 10/159560, filed on May 31, 2002, granted, now 6,972,578. | ||
| Application 11/548183 is a continuation of application No. 11/216579, filed on Aug. 30, 2005, granted, now 7,119,564. | ||
| Application 10/159560 is a continuation in part of application No. 10/034412, filed on Dec. 27, 2001, granted, now 7,002,363. | ||
| Application 10/034412 is a continuation in part of application No. 10/003012, filed on Nov. 02, 2001, granted, now 7,071,714. | ||
| Prior Publication US 2007/0139060 A1, Jun. 21, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G01R 31/02 (2006.01) | ||
| U.S. Cl. 324—754 [324/158.1] | 9 Claims |
| 1. A probe card assembly comprising:
a plurality of probes coupled to a structure configured to be mounted in and removed from a test system for testing dies of
a semiconductor wafer, the probes comprising contact tips configured to contact pads on dies of the wafer, wherein the contact
tips are disposed in a generally planar orientation that corresponds to the pads on the dies; and
a light beam emitter coupled to the structure and configured to produce a light beam and direct the light beam away from the
probe card assembly in a direction that is generally parallel to the planar orientation of the contact tips to a light beam
receiver located away from the probe card assembly.
|