| US 7,560,811 B2 | ||
| Semiconductor device | ||
| Shingo Sakakibara, Hamamatsu (Japan); Hiroshi Saitoh, Iwata (Japan); and Toshihisa Suzuki, Hamamatsu (Japan) | ||
| Assigned to Yamaha Corporation, Shizuoka-Ken (Japan) | ||
| Filed on Dec. 06, 2006, as Appl. No. 11/634,384. | ||
| Claims priority of application No. 2005-354458 (JP), filed on Dec. 08, 2005; application No. 2005-354459 (JP), filed on Dec. 08, 2005; application No. 2005-376396 (JP), filed on Dec. 27, 2005; application No. 2006-021164 (JP), filed on Jan. 30, 2006; application No. 2006-048351 (JP), filed on Feb. 24, 2006; application No. 2006-303717 (JP), filed on Nov. 09, 2006; and application No. 2006-303837 (JP), filed on Nov. 09, 2006. | ||
| Prior Publication US 2007/0210392 A1, Sep. 13, 2007 | ||
| Int. Cl. H01L 29/82 (2006.01) | ||
| U.S. Cl. 257—704 [257/414; 257/E21.5] | 35 Claims |
| 6. A semiconductor device having a semiconductor sensor chip in which a diaphragm is formed so as to detect pressure applied
thereto due to displacement thereof said semiconductor device comprising:
a resin layer having an internal recess for arranging the semiconductor sensor chip having the diaphragm disposed thereon;
a stage having a rectangular shape, which is positioned below the semiconductor sensor chip and is sealed with the resin layer;
a plurality of external terminals whose first ends are connected to the stage and whose second ends are exposed and extend
externally of the resin layer; and
a cover member, having conductivity, for covering the resin layer so as to form a space embracing the semiconductor sensor
chip,
wherein the cover member is electrically connected to the plurality of external terminals and is placed substantially at a
same potential as the stage.
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