| US 7,559,827 B2 | ||
| Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad | ||
| Toshiya Saito, Tokyo (Japan) | ||
| Assigned to Elpida Memory, Inc., Tokyo (Japan) | ||
| Filed on Mar. 20, 2008, as Appl. No. 12/51,965. | ||
| Claims priority of application No. 2007-076874 (JP), filed on Mar. 23, 2007. | ||
| Prior Publication US 2008/0233842 A1, Sep. 25, 2008 | ||
| Int. Cl. B24B 1/00 (2006.01) | ||
| U.S. Cl. 451—56 [451/443] | 20 Claims |
| 1. A dresser adapted to a chemical mechanical polishing apparatus so as to perform dressing on a polishing pad, comprising:
a support surface having a circular shape, which is positioned opposite to and in contact with the polishing pad;
at least three polish retainers having band-like shapes, which are formed on the support surface and which are elongated from
substantially the center of the support surface in respective radial directions;
a plurality of parallel portions, which are formed in a sectorial region defined between two adjacent polish retainers and
which are arranged in parallel with one of the two adjacent polish retainers; and
a plurality of non-polish retainers having band-like shapes, which are formed between one of the two adjacent polish retainers
and the plurality of parallel portions.
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