| US 7,559,155 B2 | ||
| Method and system for drying semiconductor wafers in a spin coating process | ||
| David C. Hall, Murphy, Tex. (US) | ||
| Assigned to Texas Instruments Incorporated, Dallas, Tex. (US) | ||
| Filed on May 17, 2004, as Appl. No. 10/847,549. | ||
| Application 10/847549 is a division of application No. 10/326351, filed on Dec. 02, 2002. | ||
| Claims priority of provisional application 60/343633, filed on Dec. 28, 2001. | ||
| Prior Publication US 2004/0209417 A1, Oct. 21, 2004 | ||
| Int. Cl. F26B 5/08 (2006.01) | ||
| U.S. Cl. 34—325 [34/58; 34/312] | 21 Claims |
| 1. Apparatus for drying the backside of a semiconductor wafer comprising:
a spin mechanism for spin coating a semiconductor wafer, the spin mechanism having a wafer chuck for securing the wafer; and
one or more gas ports adapted to deliver one or more pressurized gas jets to the backside of a semiconductor wafer secured
to the spin chuck for evaporatively drying the backside of the semiconductor wafer.
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