| US 7,557,593 B2 | ||
| Probe for electrical test and probe assembly | ||
| Hideki Hirakawa, Hirosaki (Japan); Akira Souma, Hirakawa (Japan); Takayuki Hayashizaki, Hirakawa (Japan); and Shinji Kuniyoshi, Tokyo (Japan) | ||
| Assigned to Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo (Japan) | ||
| Filed on Jan. 26, 2007, as Appl. No. 11/627,900. | ||
| Claims priority of application No. 2006-060551 (JP), filed on Mar. 07, 2006. | ||
| Prior Publication US 2007/0210813 A1, Sep. 13, 2007 | ||
| Int. Cl. G01R 1/067 (2006.01); H01R 12/00 (2006.01); H01R 4/02 (2006.01) | ||
| U.S. Cl. 324—754 [439/83; 439/876] | 9 Claims |
| 1. A probe for electrical test comprising:
a probe body having a base end attached to a support base plate through a solder and having a front end continuous with the
base end; and
a surface layer showing a conductivity higher than that of said probe body and a solder wettability higher than that of said
probe body, said surface layer extending from said base end to said front end on the surface of said probe body, wherein in
the vicinity of said base end of said surface layer, an annular channel in said surface layer terminating at said probe body
extends around said probe body, and a shield region with the solder wettability smaller than that of said surface layer is
formed in said annular channel, flush with said surface layer.
|