| US 7,557,435 B2 | ||
| Micro-device encapsulation having light and moisture control | ||
| Shaoher X. Pan, San Jose, Calif. (US) | ||
| Assigned to Spatial Photonics, Inc., Sunnyvale, Calif. (US) | ||
| Filed on Apr. 15, 2007, as Appl. No. 11/735,469. | ||
| Application 11/735469 is a continuation in part of application No. 11/690776, filed on Mar. 23, 2007. | ||
| Prior Publication US 2008/0273233 A1, Nov. 06, 2008 | ||
| Int. Cl. H01L 23/02 (2006.01); H01L 23/20 (2006.01) | ||
| U.S. Cl. 257—678 [257/682] | 29 Claims |
| 1. A method for fabricating an encapsulation device for encapsulating a micro device, comprising:
holding a shadow mask over an encapsulation cover having a plurality of openings, wherein the shadow mask includes a base
mask portion, one or more openings in the base mask portion, a central mask portion, and one or more connector portions connecting
the central mask portion to the base mask portion;
aligning the position of the shadow mask relative to one or more openings in the encapsulation cover;
depositing one or more target materials through the one or more openings in the shadow mask to form a layered structure on
the encapsulation cover, wherein the layered structure comprises an opening defined by the central mask portion of the shadow
mask; and
forming one or more spacer walls on the layered structure on the encapsulation cover.
|