| US 7,557,384 B2 | ||
| Semiconductor light emitting device and semiconductor light emitting unit | ||
| Iwao Matsumoto, Fukuoka-ken (Japan); and Tatsuo Tonedachi, Fukuoka-ken (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Minato-ku, Tokyo (Japan) | ||
| Filed on Mar. 28, 2006, as Appl. No. 11/390,240. | ||
| Claims priority of application No. 2005-098970 (JP), filed on Mar. 30, 2005. | ||
| Prior Publication US 2006/0220048 A1, Oct. 05, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 29/22 (2006.01); H01L 29/24 (2006.01) | ||
| U.S. Cl. 257—99 [257/79; 257/98; 257/100; 257/E33.056; 257/E33.057; 438/27; 438/28; 250/200; 250/239] | 20 Claims |
| 1. A semiconductor light emitting device, comprising:
a mold resin having a cup shape portion on an upper surface of the mold resin;
a first lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, the first lead
having a first lead section and a second lead section, the second lead section of the first lead being thicker than the first
lead section of the first lead, the second lead section of the first lead having a hole;
a second lead provided in the mold resin and extending from the cup shape portion to outside of the mold resin, having a first
lead section and a second lead section, the second lead section of the second lead being thicker than the first lead section
of the second lead;
a light emitting element mounted on the second section of the first lead in the cup shape portion;
a wire electrically connecting the light emitting element and the second lead; and
a sealing resin configured to seal the light emitting element and the wire,
wherein the first and second lead sections of the first lead and the first and second lead sections of the second lead each
having a substantially coplanar rear face, and
wherein at least a part of the rear face of the first lead section of the first lead and at least a part of the rear face
of the first lead section of the second lead being not covered with the embedding resin but being exposed.
|